柔性半导体器件标准体系构建研究与探讨

摘要：

【目的】柔性半导体器件凭借其轻、薄、柔等特性，能够便捷地与生物或装备进行集成，但相关技术标准缺失制约了其在各领域的深度拓展与规模化应用，亟须建立健全柔性半导体器件标准体系。【方法】通过梳理柔性半导体器件的国内外标准化现状，系统分析了柔性半导体器件产业技术演进对标准体系的挑战，归纳并构建了包括基础通用标准、设计标准、工艺标准、产品标准、测试与评价标准、应用标准共6个子体系类别的柔性半导体器件标准体系框架。【结果】当前标准体系呈现测试标准集中、整体覆盖不足等特征，需通过构建快速响应与前瞻布局并行的标准研制范式、强化标准的顶层设计与协同、深化基础研究和复杂验证能力建设、实施“技术—标准—市场”联动战略等路径促进标准体系建设。【结论】建立科学、合理、全面的柔性半导体器件标准体系，为政策制定者、行业监管机构、技术研究者和产业界提供参考，有助于推动柔性半导体技术高质量稳定发展。

Abstract:

[Objective] Flexible semiconductor devices, with their inherent characteristics of being lightweight, thinprofile, and flexible, can be integrated with biological systems or equipment for diverse applications. However, the absence of relevant technical standards has hindered their in-depth expansion and widespread deployment across various sectors. Therefore, establishing and improving a comprehensive standards system for flexible semiconductor devices is urgently needed. [Methods] By reviewing the current status of standardization for flexible semiconductor devices both domestically and internationally, this paper systematically analyzed the challenges posed by industrial technological evolution to the standard system. A framework for the flexible semiconductor device standard system was constructed and categorized into six subsystems: fundamental and general standards, design standards, process standards, product standards, testing and evaluation standards, and application standards. [Results] The current standards system is characterized by a concentration of testing standards, yet overall insufficient coverage. To advance standards system development, several strategic pathways are proposed: establishing a rapid-response and forward-looking standard development paradigm, strengthening top-level design and coordination of standards, enhancing fundamental research and complex verification capabilities, and implementing a technology-standardsmarket integrated strategy. [Conclusion] A well-conceived and comprehensive standards system for f lexible semiconductor devices offers a valuable reference for policymakers, regulators, researchers, and industry, thereby supporting the high-quality and stable development of flexible semiconductor technology.

引用格式：何志峰，王凯旋，徐祝青，等. 柔性半导体器件标准体系构建研究与探讨[J]. 标准化学报，2026（9）：138-148.

基金项目：本文受国家重点研发计划项目“柔性电子多物理量监测系统可靠性测试分析技术”（项目编号：2023YFF0616800）资助。

作者简介：何志峰，博士研究生，研究方向为柔性电子可靠性测试与分析技术。王凯旋，硕士研究生，研究方向为柔性电子器件可靠性测试技术。徐祝青，硕士研究生，研究方向为质量管理与标准化。朱明敏，博士，副教授，研究方向为柔性电子器件设计、表征及应用。朱海斌，博士，研究员，研究方向为柔性电子测试与应用技术。杨晓锋，博士，高级工程师，研究方向为柔性电子失效分析技术及标准化。周浩淼，通信作者，博士，教授，研究方向为柔性电子可靠性。马少鹏，博士，教授，研究方向为AI+光测力学、柔性传感系统及其可靠性。汤知源，博士，高级工程师，研究方向为高性能纤维材料。